光伏激光劃片機如何對電池片進行多分片劃切

光伏激光劃片機實現(xiàn)電池片多分片劃切，需結(jié)合高精度激光技術(shù)、智能控制系統(tǒng)與工藝優(yōu)化策略。以下從技術(shù)原理、工藝流程、行業(yè)案例三個維度為您解析：

To achieve multislice cutting of solar cells using photovoltaic laser cutting machines, it is necessary to integrate highprecision laser technology, intelligent control systems, and process optimization strategies. The following analysis is provided from three dimensions: technical principles, process procedures, and industry cases.

一、核心技術(shù)原理

激光與材料相互作用納秒/皮秒脈沖激光：聚焦后形成直徑＜50μm的光斑，瞬時功率達兆瓦級，通過激光-材料非線性吸收效應(yīng)實現(xiàn)「冷加工」  

Pulsed lasers in the nanosecond/ picosecond range: After focusing, they form a spot with a diameter of less than 50μm and an instantaneous power reaching the megawatt level. They achieve "cold processing" through the nonlinear absorption effect between the laser and the material.

熱應(yīng)力控制斷裂：激光加熱形成改性層（SD層），配套噴水冷卻產(chǎn)生溫度梯度，誘導(dǎo)材料沿預(yù)定路徑斷裂  

Thermal stresscontrolled fracture: The laser heats to form a modified layer (SD layer), and the accompanying water spray cooling creates a temperature gradient to induce the material to fracture along the predetermined path.  

多分片控制算法

動態(tài)路徑規(guī)劃：根據(jù)分片數(shù)量（1/2-1/5片）自動計算切割軌跡，采用「Z型」或「回字型」路徑減少空程  

Dynamic path planning: Automatically calculate the cutting trajectory based on the number of slices (1/21/5), and use "Zshaped" or "squareshaped" paths to reduce the empty travel.

功率密度調(diào)制：邊緣區(qū)域降低激光功率（比中心低15%-20%），避免過燒損傷  

Power density modulation: Reduce the laser power in the edge area (15%-20% lower than the center) to avoid over-burning damage.  

二、典型工藝流程

以中步擎天CTC-80S設(shè)備為例：

上料定位

雙視覺系統(tǒng)（紅外+可見光）對電池片進行初定位（±0.5mm）→精定位（±10μm）  

The dualvision system (infrared + visible light) performs initial positioning (±0.5mm) on the battery slice → precise positioning (±10μm).  

真空吸附系統(tǒng)采用「蜂窩狀多孔陶瓷」，均勻分布吸附力（波動＜±0.01MPa）  

The vacuum adsorption system uses "honeycomb porous ceramics" to evenly distribute the adsorption force (fluctuation < ±0.01MPa).  

激光劃切

預(yù)劃槽：300W激光在電池片兩端刻蝕深度40%的V型槽（寬度＜80μm）  

Pregrooving: A 300W laser etches a Vshaped groove with a depth of 40% at both ends of the battery slice (width < 80μm).  

主切割：沿預(yù)定路徑進行隱形切割，激光波長1064nm，脈沖頻率50kHz，切割速度800mm/s  

Main cutting: Invisible cutting is performed along the predetermined path, with a laser wavelength of 1064nm, a pulse frequency of 50kHz, and a cutting speed of 800mm/s.  

自動裂片

機械臂施加可控壓力（0.2-0.5N/mm2），配合冷卻水噴射實現(xiàn)無損傷分離  

The robotic arm applies controllable pressure (0.20.5N/mm2), and the cooling water spray is used to achieve damage-free separation.  

碎片率＜0.3%，切割良率＞99.5%  

Fragmentation rate < 0.3%, cutting yield > 99.5%.

下料分選

采用AI視覺對分片進行尺寸/電性能檢測，不良品自動剔除至回收盒  

AI vision is used to inspect the size and electrical performance of the sliced pieces, and defective products are automatically removed to the recycling box.  

三、未來技術(shù)趨勢

設(shè)備端：

開發(fā)「多光束協(xié)同」系統(tǒng)，單設(shè)備支持4-8路激光并行加工  

Develop a "multibeam collaborative" system that supports 48 parallel laser processing on a single device.  

引入量子傳感技術(shù)，實現(xiàn)切割過程應(yīng)力場實時監(jiān)測  

Introduce quantum sensing technology to achieve realtime monitoring of the stress field during the cutting process.  

工藝端：

研究「激光-化學(xué)復(fù)合切割」，通過激光誘導(dǎo)電解液反應(yīng)實現(xiàn)納米級精度控制  

Research "laserchemical composite cutting" to achieve nanometerlevel precision control through laser-induced electrolyte reactions.  

探索「動態(tài)頻率調(diào)制」，根據(jù)材料特性自動優(yōu)化激光參數(shù)  

Explore "dynamic frequency modulation" to automatically optimize laser parameters based on material characteristics.

建議新建產(chǎn)線優(yōu)先考慮「激光開槽+熱應(yīng)力分離」技術(shù)路線，現(xiàn)有產(chǎn)線可通過升級控制系統(tǒng)、優(yōu)化冷卻工藝實現(xiàn)碎片率下降40%-60%。對于特殊需求（如超薄異質(zhì)結(jié)電池），建議采用皮秒激光+低溫等離子體輔助切割方案。  

It is recommended that new production lines prioritize the "laser grooving + thermal stress separation" technology route. Existing production lines can reduce the fragmentation rate by 40%-60% by upgrading the control system and optimizing the cooling process. For special needs (such as ultrathin heterojunction batteries), it is recommended to use a picosecond laser + lowtemperature plasmaassisted cutting solution.